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Leak : Helio X30 Chip to be Manufatured with 10nm Process, and Features Deca-Core Design

Details about Mediatek's Helio X30 was leaked today by analyst Pan Jiutang on his Weibo account. According to him, the MediaTek Helio X30 chipset will be manufactured using a 10nm manufacturing process will come with ten CPU cores setup aas the X20 and X25 - but this time around, the chip will be a combination of the new ARM Artemis cores, Cortex A53 and Cortex A35 cores.

Additionally, the X30 will support quad channel LPDDR4 RAM with support for upto 8GB of memory and come with a PowerVR GPU and also with support for super fast UFS 2.1 standard Jiutang also provides a presentation slide, which shows the MediaTek Helio X30 scores 160,000 points on the Antutu benchmark, beating the Snapdragon 820 by 30,000.

MediaTek's plans the Helio X30 to be its flagship chipset for 2017. The analyst reveals that until then the company aims to optimize power consumption. There are no details on which devices will use the upcoming chipset.


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